+
  • 45f4ddde-2a98-44bc-aec4-02092d500b3a.jpg

Off screen fingerprint Bonding automatic line

Under screen fingerprint ultrasonic process design can realize fully automatic operation of product cleaning, bonding, AOI, dispensing, loading and unloading

Category:

Bonding Equipment

Products

3C Digital Field


Contact Us

Product Description

Specifications

Maximum bonding accuracy: ± 0.03mm

Related products