Full automatic Bangding Line S8021
The equipment is a small-sized full-automatic FOG (Film on glass), which has the capability of multilateral single section and multilateral multi section FPC, COF bonding, meets the requirements of high-precision TFT-LCD, OLED, HINK full-automatic ACF multilateral single section&multi section adhesion, and realizes 1-6 section FPC prepressing and the whole process of local pressing.
Products
3C Digital Field
Bonding Equipment
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Product Description
Specifications
| Corresponding Product Range | 3 - 8寸 3～8 inch |
| (mm) Bonding accuracy | ±0.010mm |
| Machine Weight | 4500 kg |
| Machine LayoutL | 4500*W 1600*H 2200 |
| Application Range | IC与FILM、OGS、TP、LCD、PCBBonding |
| Productivity | 900 PCS/h |
Action flow
Scope of application
Television
Pad Display
Mobile-phone Screen
liquid-crystal Display
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