SKD308T tri-temperature pick and place test handler-Shenzhen S-king Intelligent Equipment Co., Ltd.

CN / EN

SKD308T tri-temperature pick and place test handler

The SKD308T tri-temperature pick and place test handler is suitable for DFN, QFN, LQFP, LGA, BGA, CSP, SOP, MSOP and other product specifications in 3X3-110X110 low temperature/normal temperature/high temperature test and classification requirements. To bring high quality product output to customers.

Category:

Products

Semiconductor Field

Test Sorting Equipment

Product Description

● High precision ATC system: wide temperature range (-55 ℃~ 175 ℃), accurate temperature control (accuracy ± 1℃), to meet the needs of different test scenarios;

● Taking and discharging mechanical arm: Y-axis is double-sided drive mode; Z-axis motor independent control, equipped with 2X4 taking and discharging nozzle, X Pitch variable; The nozzle module adopts the span beam design, the center of gravity is stable, not easy to deform;

● Pressure measuring module: equipped with precision floating head and socket stack sensor, automatic calculation of pressure measurement, up to support 120 kgf;

● Shuttle module: XY two directions are equipped with sensors, accurately detect whether the shuttle car is stacked or not flat, protect materials; The unloading shuttle car has the function of return temperature heating;

● Plate module: feed plate is equipped with motor screw, it is more convenient to adjust when using different thickness plate; ● Automatic cleaning function: configure the cleani

Important parts


Bilateral drive structure: bilateral double slider synchronous belt drive structure, high precision, fast speed, long life.	Z-axis motor independent control, 2X4 mode, suction nozzle XPitch variable. Adopts the cross-beam mode design, the center of gravity is stable, the structure is stable and not easy to deform.	The shuttle is equipped with XY two direction sensors, and the shuttle car has the function of return temperature heating.

Table parameters

Suitable package	DFN, QFN, LQFP, LGA, BGA, CSP, SOP, MSOP Dimensions: 3X3-110X110
UPH	Max 8K at room temperature, max 6K at high/low temperature (8site, QFN4X4 as an example)
Test Station	1X2/2X2site(X = 80mm, Y = 60mm),1X4/2X4site(X = 40mm,Y = 60mm)
loading & Unloading	Tray input + Tray output
Drive mode	Take and discharge material Y axis adopts bilateral guide rail transmission
Equipment stability	JAM RATE < 1/5000, MTBA>60min, MTTA<3min, MTBF>168H
Temperature control system	Range -55°C~175 °C, accuracy ±1 °C, refrigerant
Communication interface	RS232/TTL/GPIB/ Network port
Air Pressure	0.4-0.7 MPa
Dimensions	Handler:2210x1725x2200mm Dryer (optional), chiller (optional)
Power supply	220V/380V, 130A(chiller)+45A(Handler), 50/60Hz