SKD308TB TRI-temperature Pick&Place Test Handler-Shenzhen S-king Intelligent Equipment Co., Ltd.

CN / EN

SKD308TB TRI-temperature Pick&Place Test Handler

SKD308TB TRI - temperature Pick&Place Test Handler is applicable for multi-functional testing and sorting needs to meet customers' diverse testing needs. It is suitable for low/ normal/high-temperature testing, sorting, and classification of MSOP/QFN/LGA/BGA/CSP (3X3-10X10 mm) , and integrates imaging systems to yield high-quality product output to customers.

Category:

Products

Semiconductor Field

Test Sorting Equipment

Product Description

●High-precision ATC system: wide temperature range ( -55℃~175℃), precise temperature control ( accuracy ± 1 ℃ ) , meeting the needs of different test scenarios;

●Loading and offloading methods: Bowl in, supporting two offloading modes: Bin out and Tray out ;

●Image detection: equipped with top image, 3D5S image, used to identify the chip direction and detect appearance defects;

●Loading and unloading nozzle: 2X4 mode, the nozzle can be edged in the X direction, the Z- axis motor of the nozzle is independently controlled, and the Y- axis direction is a bilateral drive mode;

●Plate changing manipulator: Clamping method, safe and reliable, and also has automatic pull-up function when power fails.

●Testing institution: supports four test modes: single site , two sites ( 1x2 ), four sites ( 1x4 , 2x2 ), and eight sites ( 2x4 ).with automatic calibration, automatic calculation of pressure measurement, and socket stacking detection functions .

●Automatic cleaning function: equipped with a cleaning disk assembly, the device automatically cleans the probe after the number of tests reaches the set value.

●Can be connected to multiple brands of testing equipments, has independent software property rights, and supports RS232/TTL/GPIB and other communication methods.

Important parts


Vibrating plate loading, top image configuration, 3D5S , polarity test (optional), rich configurations and powerful functions.	Cross-feeding reduces the waiting time for mechanism actions and improves efficiency.	The Unloading structure is equipped with a material box (one large and four small, optional) and a material tray structure, making it applicable to a wider range of scenarios.

Table parameters

Suitable package	DFN, QFN, LGA, CSP, SOP, MSOP, TSSOP Dimensions: 3X3-10X10
UPH	max 8K at room temperature, max 6K at high/low temperature (8site, QFN4X4 as an example)
Test Station	1X2/2X2site(X Pitch 80mm, Y Pitch 60mm）1X4/2X4site(X Pitch 40mm, y Pitch 60mm）
Classification	Material box components: large BlN box (1 piece), small BlN box (4 pieces);Material tray components: empty tray feeding components (2 pcs), automaticUnloading components (3 pcs), manual tray (1 pc)
Stability	MTBA>60min，MTTA<3min，MTBF>168H
Temperature Control System	Range -55°C~175°C, accuracy ±1°C, Refrigerant
Communication I/O	RS232/TTL/GPIB/ Network port
Air pressure	0.4-0.7MPa
Dimensions	Handler:2210x1725x2200mm Dryer (optional), chiller (optional)
Power supply	220V/380V, 130A(chiller)+45A(Handler), 50/60Hz