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Guide to selecting semiconductor-related majors at the undergraduate and graduate levels

Guide to choosing semiconductor-related majors at the undergraduate and graduate levels;Introduction to related majors at the undergraduate level

Guide to selecting semiconductor-related majors at the undergraduate and graduate levels

2025 Semiconductor Industry Report

In 2025, the global semiconductor industry is at the intersection of the dual cycles of “post epidemic + AI detonation”. Memory and arithmetic chips continue to lead, mature node price bottoming out, advanced process demand exceeds supply. As long as AI, automotive, industrial automation three major demand engines do not lose speed, the industry is expected to achieve double-digit growth in 2025-2026, towards a new stage of $800 billion.

2025 Semiconductor Industry Report

Mobile Phone Panel Shipment Ranking in the First Quarter: BOE Tops

According to the global smartphone panel shipment tracking data from Sigmaintell, the shipment volume was about 540 million pieces (Open Cell aperture), which was basically flat year-on-year.

Mobile Phone Panel Shipment Ranking in the First Quarter: BOE Tops

Panel industry development prospect analysis

In the future, the display panel industry will continue to develop in the direction of high resolution, large size, flexibilization, and intellectualization, making greater contributions to the prosperity of the global electronics industry.

Panel industry development prospect analysis

Briefly describe the relevant characteristics and performance of the laminating machine

The spaceBetween laminating machine includes unwinding device, gluing device, conveying and pressurizing device, driving motor and other major mechanical parts. The automatic laminating machine is mainly designed for the production characteristics of small displays and small touch components, and is one of the necessary equipment for LCD production. Our company introduces its characteristics and performance.

Briefly describe the relevant characteristics and performance of the laminating machine

What is a binding aircraft?

Bonding machine is a device that accurately positions IC chips on LCD glass and binds them. The whole machine is composed of PLC+HMI control core. The image automatic alignment system PV310 completes the calculation of the alignment data of the target object, and the product is transferred from the platform to the local pressure for binding and crimping after the completion of alignment and preloading.

What is a binding aircraft?

Be sure to know the three factors about the bonding machine

Bonding machine is a kind of production equipment widely used in electronic, touch screen and other operations. Pulse heating method is used to cooperate with titanium alloy hot pressing head to quickly raise temperature and cool down after finishing, and the role of precise temperature control is useful to ensure product quality. It is mainly used for soldering the inner leads of semiconductor devices such as digital tubes, lattice, integrated circuit soft packaging, thick mode integrated circuits, transistors, etc.

Be sure to know the three factors about the bonding machine

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Copyright ◎ Shenzhen Shenkeda Intelligent Equipment Co., Ltd       粤ICP备12028729号        Powered by:300.cn  SEO

Copyright ◎ Shenzhen Shenkeda Intelligent Equipment Co., Ltd

粤ICP备12028729号 

Powered by:300.cn   SEO