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SKD308H Pick&Place Test Handler

SKD308H Pick&Place Test Handler is applicable for testing and sorting MSOP、QFN、DFN、LQFP、LGA、BGA、CSP and other products with specifications ranging from 3x3 to 110x110, meeting the requirements for both room temperature and high-temperature testing and sorting, while delivering high-quality product output for customers.

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Semiconductor Field

Test Sorting Equipment


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Product Description

SKD308H Pick&Place Test Handler is applicable for testing and sorting MSOP、QFN、DFN、LQFP、LGA、BGA、CSP and other products with specifications ranging from 3x3 to 110x110, meeting the requirements for both room temperature and high-temperature testing and sorting, while delivering high-quality product output for customers.

 

● Automatic loading and offloading:One automatic loading site, three automatic offloading sites and three manual offloading sites, One site of automatic receiveing empty tray, and one site of automatic providing empty trays.
● Number of pickheads for loading and offloading:8,The Z-axis motor of each pickhead is controlled independently, and the Y-axis direction is driven bilaterally.
● Tray in/Tray out :The preheating temperature of the feed shuttle plate is 50~150 ℃ ±3 ℃, which has the function of sensor inspection in:1X2, 2x2,1X4,2X4.
● Pickup arm for tray replacement: 1, with automatic pull-up function when power down
● Pressure measuring mechanism: mode 1avo 1X2ax 1X4 2:2X2/2X4 40 ±0.01mm mode 2:2X2/2X4, X = 40 ±0.01 mm,Y= 60 ±0.01 mm. The pressure measurement can be calculated automatically according to the number of IC feet / balls.
● Pressure measuring area: it has the function of image inspection whether there is stacking material or not  to prevent misjudgment.
● Can connect a variety of brand testing equipments,  independent property rights software, using key switches, standard keyboard for operation and data input.

 

 

Important parts 


 

The Y axis of the loading and unloading suction nozzle is designed with double linear guide rail and double power drive, which has long service life, high precision and more stable long-term operation. The special pneumatic floating pressure head can automatically calculate the pressure according to the number of IC feet / balls. The test arm Y-axis independent motor control can better achieve position control.

 

 

 

 

Table parameters


 

Suitable package  MSOP、QFN、DFN、LQFP、LGA、BGA、CSP Dimensions: 3X3-110X110
UPH Max 13.5K pcs/H(8site,QFN4X4)
Test Station 1X2/2X2site(X = 80mm, Y = 60mm),1X4/2X4site(X = 40mm,Y = 60mm), 2X8 site(X = 30mm,Y = 60mm)
Compression Test Max 240kgf
Tray 300mmX146mm
Stability JAM RATE<1/10000,MTBA>60min   MTTA<3min   MTBF>168H
Temperature Range 50~90℃±2℃, 90~150℃±3℃
Communication I/O RS232/TTL/GPIB/Network port
Index time 0.42S
Pressure ≥0.5Mpa,550L/min
Vacuum Built-in Vacuum Functionality
Dimensions 2135*1545*2000(mm)
Power Source AC220V/380V 50/60Hz
Classification 3 Automatic tray, 3 Manual tray
Weight 1300KG

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