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SKD308TB TRI-temperature Pick&Place Test Handler
Published:
2025-12-12 09:44
SKD308TB TRI-temperature pick&place test handler is applicable for multi-functional testing and sorting needs to meet customers' diverse testing needs. It is suitable for low/normal/high-temperature testing, sorting, and classification of MSOP/QFN/LGA/BGA/CSP(2X2-10X10 mm), and integrates imaging systems to yield high-quality product output to customers.
● Loading and offloading methods: bowl in, supporting two offloading modes: bin out and tray out.
● Image detection: equipped with top image, 3D5S image, used to identify the chip direction and detect appearance defects.
● Loading and unloading nozzle: 2X4 mode, the nozzle can be edged in the X direction, the Z-axis motor of the nozzle is independently controlled, and the Y-axis direction is a bilateral drive mode.
● Temperature control system: Test TJ: ±2℃; Preheating tray/Shuttle: ±3℃; TC: ±1℃; 200W@ -55℃/300W@ -40℃/850W @ 25℃/1150W@ 85~150℃ / 200℃(Optional).
● Plate changing manipulator: clamping method, safe and reliable, and also has automatic pull-up function when power fails.
● Testing institution: supports four test modes: single site, two sites(1x2), four sites(1x4, 2x2), and eight sites(2x4).with automatic calibration, automatic calculation of pressure measurement, and socket stacking detection functions .
● Automatic cleaning function: equipped with a cleaning disk assembly, the device automatically cleans the probe after the number of tests reaches the set value.
● Can be connected to multiple brands of testing equipments, has independent software property rights, and supports RS232/TTL/GPIB and other communication methods.
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| Vibrating plate loading, top image configuration, 3D5S , polarity test (optional), rich configurations and powerful functions. | Cross-feeding reduces the waiting time for mechanism actions and improves efficiency. | The Unloading structure is equipped with a material box (one large and four small, optional) and a material tray structure, making it applicable to a wider range of scenarios. |
Parameter Information
Suitable components | DFN, QFN, LGA, CSP, SOP, MSOP, TSSOP |
UPH | Max 8K（8site，QFN4X4） |
Test station | 1X2/2X2site(X Pitch 80mm, Y Pitch 60mm）1X4/2X4site(X Pitch 40mm, y Pitch 60mm） |
Classification | Material box components: large BlN box(1 pcs), small BlN box(4 pcs). |
Stability | MTBA>60min，MTTA<3min，MTBF>168H |
Temperature control system | Test TJ: ±2℃; Preheating tray/Shuttle: ±3℃; TC: ±1℃; |
Communication I/O | RS232/TTL/GPIB/ Network port |
Pressure | 0.4-0.7MPa |
Dimensions | 2210x1725x2200mm Dryer group(optional), Chiller(optional) |
Power supply | 220V/380V, 130A(chiller)+45A(Handler), 50/60Hz |
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Shenzhen Headquarters: B10/F, Block BC, Huizhi R&D Center, Xixiang Street, Bao'an District, Shenzhen City, Guangdong Province, China..
Huizhou Base: 201 Yueming Road, Sanhe Village, Tonghu Town, Zhongkai High tech Zone, Huizhou City, Guangdong Province, China.
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