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SKD308T tri-temperature pick and place test handler

Published:

2025-12-12 09:26

 

The SKD308T tri-temperature pick and place test handler is suitable for DFN, QFN, LQFP, LGA, BGA, CSP, SOP, MSOP and other product specifications in 2X2-110X110 low temperature/normal temperature/high temperature test and classification requirements. To bring high quality product output to customers. 

 

● Taking and discharging mechanical arm: Y-axis is double-sided drive mode; Z-axis motor independent control, equipped with 2X4 taking and discharging nozzle, X Pitch variable. The nozzle module adopts the span beam design, the center of gravity is stable, not easy to deform. 

● Pressure measuring module: equipped with precision floating head and socket stack sensor, automatic calculation of pressure measurement, up to support 120 kgf. 

● Shuttle module: XY two directions are equipped with sensors, accurately detect whether the shuttle car is stacked or not flat, protect materials; The unloading shuttle car has the function of return temperature heating. 

● Temperature control system: Test TJ: ±2℃; Preheating tray/Shuttle: ±3℃; TC: ±1℃;  200W@ -55℃/300W@ -40℃/850W @ 25℃/1150W@ 85~150℃ / 200℃(Optional).

● Plate module: feed plate is equipped with motor screw, it is more convenient to adjust when using different thickness plate. 

● Automatic cleaning function: configure the cleaning plate assembly, the device automatically cleans the probe after the number of tests reaches the set value. 

● Changing tray pickup arms: clamping claw mode, stable and reliable, with power failure automatic pull-up function. 

● Front and rear configuration display touch screen and key panel, support to connect a variety of brand testing machines. 

 

Bilateral drive structure: bilateral double slider synchronous belt drive structure, high precision, fast speed, long life. Z-axis motor independent control, 2X4 mode, suction nozzle XPitch variable. Adopts the cross-beam mode design, the center of gravity is stable, the structure is stable and not easy to deform. The shuttle is equipped with XY two direction sensors, and the shuttle car has the function of return temperature heating. 

 

 

Parameter Information  

Suitable package

DFN, QFN, LQFP, LGA, BGA, CSP, SOP, MSOP
Dimensions: 2X2-110X110

UPH

Max 9K (8site, QFN4X4)

Test station

1X2/2X2site(X=80mm, Y=60mm), 1X4/2X4site(X=40mm, Y=60mm)

loading&Unloading

Tray input + Tray output

Drive mode

Take and discharge material Y axis adopts bilateral guide rail transmission

Equipment stability

JAM RATE <1/5000, MTBA>60min, MTTA<3min, MTBF>168H

Temperature control system

Test TJ: ±2℃; Preheating tray/Shuttle: ±3℃; TC: ±1℃;

200W@ -55℃/300W@ -40℃/850W @ 25℃/1150W@ 85~150℃ / 200℃(Optional).

Communication interface

RS232/TTL/GPIB/ Network port

Pressure

0.4-0.7 MPa

Dimensions

2210x1725x2200mm    dryer (optional), chiller (optional)

Power supply

220V/380V, 130A(chiller)+45A(Handler), 50/60Hz