Ultrasonic Fingerprint Laminator-Shenzhen S-kING Intelligent Equipment Co., Ltd.

CN / EN

CN / EN

Ultrasonic Fingerprint Laminator

Ultrasonic Fingerprint Lamination Equipment is used for vacuum precision lamination of ultrasonic fingerprint sensor modules to the back of display panels with acoustic adhesive, eliminating air gaps to ensure stable ultrasonic transmission for fingerprint recognition.

Category:

Products

Intelligent display Field

Fingerprint sensor chip

Product Description

Item	Specification
Applicable Size	Tray outer dimension: L530 × W430 mm ±50 mm; IC Tray outer dimension: L360 × W280 mm ±50 mm; Tray stack layers: 30 ±1 layers, weight ≤35 kg IC: 5×5 mm – 20×30 mm; OLED: 60×60 mm – 100×180 mm (FPC shall be attached inside the panel); OLED: ≤200×100 mm; PSA: 5×5 ~ 40×40 mm
Lamination Accuracy	PSA lamination accuracy (machine accuracy + material tolerance): ±100 μm, CPK ≥1.33; standalone machine accuracy ≤±50 μm Fingerprint module lamination accuracy (machine accuracy + material tolerance): ±100 μm, CPK ≥1.33; standalone machine accuracy ≤±50 μm
Lamination Method	PSA lamination: mesh fixture lamination Fingerprint module lamination: vacuum lamination
Equipment TT (Takt Time)	≤4.5S
OLED Alignment	Datum edge positioned by adjustable locating pins; movable positioning stopper with adjustable height
Loading & Unloading Method	OLED & IC Tray loading; buffer Tray loader/unloader, finished product unloader for receiving, PSA magazine loading
Downtime Rate	≤4.2％

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yyk@szskd.com
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0755-2788 9869
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+86 13924635336

E-mail：yyk@szskd.com

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Shenzhen Headquarters: B10/F, Block BC, Huizhi R&D Center, Xixiang Street, Bao'an District, Shenzhen City, Guangdong Province, China..

Huizhou Base: 201 Yueming Road, Sanhe Village, Tonghu Town, Zhongkai High tech Zone, Huizhou City, Guangdong Province, China.

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Shenkeda Semiconductor

Sigal Semiconductor