Fingerprint binding-Shenzhen S-kING Intelligent Equipment Co., Ltd.

CN / EN

CN / EN

Fingerprint binding

It performs high-precision electrical bonding and optical lamination between the under-display fingerprint sensor chip (optical / ultrasonic fingerprint sensing chip), FPC flexible circuit and display panel to establish stable electrical and optical signal paths. It is the core process equipment for OLED under-display fingerprint modules.

Category:

Products

Intelligent display Field

Fingerprint sensor chip

Product Description

Item	Specification
Sensor Size	8 mm×8 mm-10 mm×11.6 mm
Sensor Thickness	0.05~0.5 mm
Sensor Tray	Max: 325×136 mm ，Stacking height: 250 mm
FPC Size	Max：110×110 mm
FPC Tray	Max：400 mm×300 mm, Stacking height: 400 mm
Tray Size	Max：400×300 mm,Stacking height: 400 mm
Sensor Loading Method	Stack type, 3-station non-stop loading
FPC Loading Method	Stack type, 3-station non-stop loading
Finished Product Unloading Method	Stack type, 2-station non-stop unloading
Press Head Temperature Control Mode	Controlled by temperature controller
ACF Bonding Accuracy	X：±100um，Y±50um（CPK＞1.33）
Pre-bonding Accuracy	±15μm（CPK＞1.33）
FOG Bonding Accuracy	±20um（CPK＞1.33）
Equipment Takt Time（TT）	≤3.9s
Sensor Cleaning Method	Alcohol Wiping + Plasma Treatment
Cleaning Performance	Water contact angle ≤ 30°, Temperature ≤ 100 ℃
Press Head Pressure	ACF: 10 N–150 N adjustable, accuracy ±1 N Pre-bonding: 10 N–150 N adjustable, accuracy ±1 N Main bonding: 10 N–300 N adjustable, accuracy ±1 N
Press Head Temperature	ACF / Pre-bonding: Temperature RT–200 ℃, accuracy ±3 ℃ Main bonding: Temperature RT–400 ℃, accuracy ±3 ℃
Offset AOI	Repeatability: ±3 μm
Adhesive Bleed AOI	Detect ACF adhesive bleed condition
Dispensing Accuracy	Width: 0.6 ~ 1.4 mm, Thickness: < 200 μm
Machine Overall Dimension	6750（L）×2050（W）×2195（H）mm
Code Scanning	Scan Sensor Tray code and FPC code at loading

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+86 13924635336

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Shenzhen Headquarters: B10/F, Block BC, Huizhi R&D Center, Xixiang Street, Bao'an District, Shenzhen City, Guangdong Province, China..

Huizhou Base: 201 Yueming Road, Sanhe Village, Tonghu Town, Zhongkai High tech Zone, Huizhou City, Guangdong Province, China.

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