TGV Vacuum Laminator
The TGV Vacuum Lamination Equipment attaches ABF prepreg dielectric films to both sides of the glass substrate, providing a flat, bubble-free dielectric layer for subsequent laser drilling and RDL electroplating.
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TGV Vacuum Laminator
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Product Description
The TGV Vacuum Lamination Equipment serves as a critical lamination unit in the advanced packaging glass substrate carrier board production line, bridging TGV metallization and SAP fine-line routing. For the mainstream FCBGA glass carrier board structure of “glass core + ABF build-up layers + ABF top-side routing”, this equipment attaches ABF prepreg dielectric films to both sides of the glass substrate, delivering a bubble-free, flat dielectric layer for subsequent laser drilling and RDL electroplating.
Quipment Advantages
- Synchronous double-sided vacuum lamination, with comprehensive technical strengths and local support to fully substitute imported equipment.
- Flatness ≤10 μm; 3-stage lamination profile for optimized compatibility with ABF film lamination processes.
- Ultimate vacuum level ≤10 Pa, fundamentally eliminating interlayer bubbles within ABF films.
- Standard working size: 515×510 mm; compatible with maximum panel size up to 600×650 mm.
- All-in-one workflow covering pre-lamination, planarization and film take-up.
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Shenzhen Headquarters: B10/F, Block BC, Huizhi R&D Center, Xixiang Street, Bao'an District, Shenzhen City, Guangdong Province, China..
Huizhou Base: 201 Yueming Road, Sanhe Village, Tonghu Town, Zhongkai High tech Zone, Huizhou City, Guangdong Province, China.
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