Fully Automated Backlight Assembly Line

Real-time pressure monitoring for backlight assembly:

High-precision pressure sensors work with proportional-valve closed-loop control to achieve real-time monitoring, real-time feedback, and instant alarm on anomalies — eliminating crushing damage and weak bonding at the source.
 

Dual-barrel automatic switching — low level only alarms, no line stop:

Traditional dispensing lines must stop for material change. Shenkeda's fully automated backlight assembly line adopts dual-barrel redundancy plus liquid-level sensors, so material change requires no line stop and directly raises UPH.
 

3D line-laser inspection + height-compensation auto dispensing:

After dispensing, a 3D line laser inspects; glue volume and position are controlled throughout, eliminating missing glue, overflow, and uneven glue thickness.
 

One-click calibration for changeover:

Calibration data is stored in the database and auto-loaded when switching part numbers, enabling mixed-model production on one line without repeated machine tuning.

Process flow:
BLU loading → BLU film removal → Plasma treatment → Dispensing & Inspection → Ultrasonic cleaning → Finished-Product flipping → PCB bottom-glue application → PCB short-foam pasting → Film removal → Manual wire insertion → FPC protective-film pasting → PCB top-glue application → Labeling → Flipping & unloading 

Fully Automated Large-Size CG Perforation Assembly Line

0.6 mm beveled-guide perforation, Micron-level threading
S-KING adopts 0.6 mm beveled guides plus an upper bell-mouth design; each guide channel has independent XY fine-tuning to keep slot openings level and consistent.

FPC three-axis precision adjustment — threads in and aligns right; Perforation success rate > 99.99%

Three-axis drive with independent three-direction adjustment keeps FPC grabbing, bending, and perforation fully controlled, eliminating skew, tilt, and breakage.

Flat / curved dual-mode flexible process — one machine, Two forms

Automatic flat perforation, manual curved perforation, plus FPC self-adaptation. This is not a simple stacking of components, but a demonstration of process-design capability.

Process flow:

Loading → Transfer → Bonding-surface cleaning → FPC bending & Perforation → Bonding & Pressure holding → Unloading

Fully Automated Dual-Screen Lamination Line

Bubble-free lamination

Vacuum-chamber lamination (ultimate vacuum -99 kPa) completely expels inter-layer air, combined with an XXY alignment stage and ultrasonic / deionized-water / IPA foreign-particle cleaning to eliminate lamination bubbles at the source.

Real-time lamination-pressure monitoring

The vacuum lamination chamber uses a lamination cylinder controlled by a proportional valve in closed loop, achieving accuracy of 0.001 MPa, with 0–10 mm back-pressure cushioning to stabilize lamination pressure in real time and avoid crushing damage and deformation.

Lamination accuracy 0.1 mm, Cpk > 1.33 — an automotive-grade mass-production commitment

This is not a one-time lamination accuracy, but proof of consistency under long-term, high-volume production.

OC process flow：Manual loading → Transfer → Scanning → Film removal → Ultrasonic cleaning → Plasma treatment → RTV dispensing → OC transfer → Lower chamber

CG process flow：Manual loading → Scanning → Deionized-water wiping & Cleaning → Dispensing → Curing → Fixture return → Flipping & Lamination

CG+OCprocess flow：Lamination → Transfer & Unloading → Unloading

The underlying logic of automotive-display manufacturing has long shifted from "a little bigger" to a comprehensive leap in accuracy, takt time, yield, and cleanliness — from black-and-white to color, from single screen to multi-screen, from flat to curved. S-KING — over two decades devoted to intelligent display equipment.