SOLUTIONS
Become a more valuable enterprise in the field of equipment
A12
Published:
2022-08-15 08:51
1: Higher precision --- ± 10 μ m/±0.2°@3 σ。
2: More intelligent --- automatic detection of base island, adhesive point, before and after fixing, and both sides of the chip.
3: More efficient --- UPH up to 3K/H.
4: Wafer -- - 12 "compatible 8".
5: Mapping -- Support single bin and multiple bin, automatically remember reference points, and automatically search starting points.
|6: LF --- width 35~100mm, length 180~300mm, thickness 0.1-3.0mm.
7: Data statistics --- production information, statistical information, CPK analysis.
Scan to learn more about us
Shenzhen Headquarters: B10-11F, Block BC, Huizhi R&D Center, Xixiang Street, Bao'an District, Shenzhen City, Guangdong Province.
Huizhou Base: 201 Yueming Road, Sanhe Village, Tonghu Town, Zhongkai High tech Zone, Huizhou City, Guangdong Province, China.
Copyright ◎ Shenzhen Shenkeda Intelligent Equipment Co., Ltd 粤ICP备12028729号 Powered by:300.cn SEO