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DAF8

Category:

Solidification Equipment

Products

Semiconductor Field


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Product Description

1: Heating function --- multi temperature zone control, maximum 200 ° C.
2: More intelligent --- automatic detection of base island, adhesive point, before and after fixation.
3: Faster --- UPH up to 18K/H.
4: Wafer --- 8 "compatible with 6".
5: LF --- width 28~100mm, length 180~300mm, thickness 0.1~1.0mm.
6: Feeding --- box and sheet are compatible.
7: Mapping -- Support single bin and multiple bin, automatically remember reference points, and automatically search starting points.
8: Data statistics --- production information, statistics, and operation logs.

 

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