+
  • 3e742d90-4688-469b-a240-e6c540b80e9a.jpg

A12

Category:

Products

Semiconductor Field

Solidification Equipment


Contact Us

Product Description

1: Higher precision --- ± 10 μ m/±0.2°@3 σ。
2: More intelligent --- automatic detection of base island, adhesive point, before and after fixing, and both sides of the chip.
3: More efficient --- UPH up to 3K/H.
4: Wafer -- - 12 "compatible 8".
5: Mapping -- Support single bin and multiple bin, automatically remember reference points, and automatically search starting points.
|6: LF --- width 35~100mm, length 180~300mm, thickness 0.1-3.0mm.
7: Data statistics --- production information, statistical information, CPK analysis.

Related products