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X12P

Category:

Solidification Equipment

Products

Semiconductor Field


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Product Description

1: Faster --- UPH up to 28K/H (based on 500 * 500um chip).
2: More intelligent --- automatic detection of base island, adhesive point, before and after fixation.
3: Faster --- quick type change, no need to change the pallet, pressing plate and track.
4: Wafer -- - 12 "compatible 8".
5: LF --- 180~300mm long, 28~100mm wide and 0.1~1.0mm thick.
6: Feeding --- box and sheet are compatible.
7: Mapping -- supports single bin and multiple bin, automatically remembers reference points, and automatically searches starting points
8: Data statistics --- production information and statistical information.

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