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D200

Category:

Solidification Equipment

Products

Semiconductor Field


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Product Description

1: Wider --- base plate 510 * 410.
2: More accurate --- ± 20 μ m@3 σ  (Based on 200 * 200um chip CPK ≥ 1.33).
3: Faster --- UPH 18K/H.
4: More intelligent --- automatic detection before and after bonding pad, bonding point, and bonding.
5: Wafer --- 6 "compatible with 4".
6: Mapping -- Support single bin and multiple bin, automatically remember reference points, and automatically search starting points.
7: Data statistics --- production information, statistical information, CPK analysis.

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