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X12

Category:

Solidification Equipment

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Semiconductor Field


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Product Description

1: More efficient --- UPH up to 21K/H (based on 500 * 500um chip).
2: More intelligent --- automatic detection of base island, adhesive point, before and after fixation.
3: Faster --- quick type change, no need to change the pallet, pressing plate and track.
4: Wafer -- - 12 "compatible 8".
5: LF --- 180~300mm long, 28~100mm wide and 0.1~1.0mm thick.
6:.  Feeding --- box and sheet are compatible.
7: Mapping -- Support single bin and multiple bin, automatically remember reference points, and automatically search starting points.
|8: Data statistics --- production information and statistical information.

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